Hollow-core Anti-resonant Fiber
Hollow-core antiresonant fiber is a revolutionary specialty optical fiber. Its core features a cavity structure that confines light propagation within the air medium rather than conventional glass, leveraging antiresonance principles. This design delivers ultra-low latency, resistance to nonlinear effects, and potential for ultra-low loss characteristics, positioning it as a cutting-edge technology for future high-speed communications, high-power laser transmission, and precision sensing applications.
Features and Advantages
- Low Signal Loss: Compared with HVLP3 copper foil, HVLP4 copper foil has a surface roughness as low as 0.6-1μm, reducing the signal loss of AI chips by 35%
- Excellent Ductility: Allows for more precise and dense circuit board design, supporting the design of smaller circuit line spacing
- High Electrical Conductivity: HVLP4 copper foil features high purity and uniform thickness, providing excellent electrical conductivity
- Strong Stability: Special process treatment improves high temperature resistance and oxidation resistance, maintaining stable electrical performance during long-term use or extreme conditions, and can be used to manufacture electronic components and packaging materials for high-temperature environments
- Excellent Interlayer Adhesion: Adopting silane coupling agent coating technology, it enhances the bonding strength between copper foil and substrate as well as other materials, improving the structural stability and reliability of multi-layer PCBs
Industry Applications
5G Communications
Servers
中文
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